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lingwogroup UV glue mainly designed to achieve better thermal shock resistance performance at greater thicknesses, especially in the higher meniscus areas between adjacent SMT components where th
The development history of epoxy resin AB glue for LED packaging ranges from the application of the initial liquid bisphenol A epoxy resin to the application of ali
Due to its excellent properties, epoxy resin has been widely used in fields such as adhesives, coatings, and composite materials. In order to increase the curing ra
LINKWORLD NEW MATERIAL CO., LIMITED
I. Technical Background In recent years, the global electronics industry has been developing rapidly, and the industry scale has expanded significantly, which has greatly driven the de
Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.