I. Technical Background
In recent years, the global electronics industry has been developing rapidly, and the industry scale has expanded significantly, which has greatly driven the development of the electronic adhesive materials industry. Although electronic adhesive materials account for a relatively small proportion in the entire adhesive materials family, they are highly concerned in the industry due to their high value-added characteristics. This kind of adhesive needs to have key characteristics such as excellent conductive or insulating properties, good thermal stability, low ion content, fast curing characteristics, reliable bonding strength, and low volatility to meet the strict requirements of modern electronic manufacturing. With the application of nanotechnology and new polymer materials, the performance of electronic-grade adhesives has been significantly improved. Innovative products such as conductive silver adhesives and UV-curable epoxy resins continue to emerge, providing strong support for emerging fields such as electronic manufacturing, semiconductors, 5G communications, and new energy vehicles. Technological progress enables electronic-grade adhesives to better adapt to complex application environments and make important contributions to the reliability and performance optimization of electronic products.
II. Technical Introduction
For different usage scenarios of products, the Jinan New Materials Industry Technology Research Institute has developed three major types of LKCM adhesives by means of molecular design, namely epoxy resin type, polyimide-modified epoxy resin type, and polyimide type. LKCM adhesives are highly favored for their excellent bonding strength, outstanding insulating properties, and good heat resistance. It can be used in various occasions such as chip packaging, circuit board bonding, and component fixation. According to application requirements, LKCM adhesives can be single-component or two-component, and can be rapidly formed by means of heat curing, UV light curing, or room temperature curing. And its thermal conductivity, shock resistance, and moisture resistance have been further improved to meet the stringent requirements of emerging fields such as 5G communications and automotive electronics. With the development of electronic products towards thinness and high reliability, new epoxy adhesives with low stress and low expansion coefficient have also emerged, promoting the continuous progress of electronic manufacturing processes.
III. Technical Details
(1) LKCM®5301
LKCM®5301 is an epoxy resin adhesive, mainly used as SMT patch adhesive. In the surface mount technology of printed circuit boards, its main function is to bond and position components before wave soldering to prevent components from shifting or falling off due to acceleration, vibration, impact, etc., and provide reliable electronic connections.
(2) LKCM®5201
LKCM®5201 adhesive has both the good curing characteristics of epoxy adhesive and the high temperature resistance and corrosion resistance of polyimide adhesive. In the manufacturing process of electronic products, it can be used to pot electronic components. For example, pouring electronic components into the casing can play a role in moisture-proof, dust-proof, and shock-proof, and improve the service life of electronic components. It can also be used as a copper clad laminate adhesive.
(3) LKCM®5101
LKCM®5101 is a polyimide high-temperature resistant adhesive. Polyimide adhesive is widely used in cutting-edge fields such as aerospace, satellite communications, nuclear energy, electrical insulation, and microelectronics industry due to its good high temperature resistance, radiation resistance, corrosion resistance, high chemical stability, good dielectric properties and mechanical properties. LKCM®5101 adhesive is mainly used as a high-temperature resistant structural adhesive.
IV. Technical Advantages
1.High temperature resistance: The LKCM series adhesives have a relatively high upper limit of use temperature and can meet the use requirements under high temperature (≥300℃) conditions.
2.Strong operability: The LKCM series adhesives have good operability. The curing temperature and curing time are adjustable, which is convenient for use.
3.Customizable products: Different application scenarios have different requirements for the performance indicators of adhesives. LKCM adhesives can be customized according to different application scenarios.
V. Technology Maturity
At present, the three products of LKCM adhesive have completed research and development and pilot scale-up. And continue to develop more environmentally friendly and efficient new precision electronic adhesives.
VI. Cooperation Methods
1.Adhesive product sales: At present, the research institute has developed a variety of adhesive products. Customers can choose different adhesive products according to different needs.
2.Adhesive technology licensing: Adhesive technology can be licensed for development, and certain technical support will be provided to cooperation partners.
3.Adhesive technology transfer: Technology transfer can be carried out for adhesive investors, providing comprehensive technical guidance and exchanges to enhance enterprise competitiveness.
4.Other cooperation methods: Various cooperation methods (market cooperation, technical cooperation, commissioned research and development and OEM, etc.) around adhesive product sales and technology promotion.
VII. Benefit Expectations
The application prospect of LKCM adhesive is broad, and it is expected to bring significant economic and technical benefits to enterprises. With the rapid development of emerging industries such as semiconductors, 5G communications, the Internet of Things, and new energy vehicles, the market demand for electronic products continues to grow, and the importance of adhesives as key materials is increasingly prominent. At the technical level, the continuously improved performance of LKCM adhesive will support more advanced electronic design, promote products to develop in the direction of thinness and high integration, and open up new market opportunities for enterprises. At the same time, the research and development of environmentally friendly adhesives will also help enterprises achieve green production and improve brand image and market competitiveness.
