Researchprogress of hot melt pressure sensitive adhesivepolyimide-based high-temperature resistant adhesive

September 27, 2024

LINKWORLD NEW MATERIAL CO., LIMITED

【Abstract】Theresearch progress of SIS-based hot melt pressure sensitive adhesive and polyurethane

hot melt pressure sensitive adhesive at home and abroad was reviewed in this

study. The advantages and disadvantages, modification methods (such as

polymerization modification, physical blending modification, chemical

modification), and research and application fields (such as metal bonding,

logistics labels, building waterproofing materials, and medical adhesives) of

both were elaborated, and the future development directions of SIS-based hot

melt pressure sensitive adhesive and polyurethane hot melt pressure sensitive

adhesive were also discussed.【Keywords】modified SIS; polyurethane; hot melt pressure sensitiveadhesive

Research progressof polyimide-based high-temperature resistant adhesive

【Abstract】Polyimide adhesive has outstanding high-temperature

resistance, dimensional stability, physical and chemical stability, dielectric

properties, and bonding properties, making it a type of adhesive with excellent

comprehensive performance, and therefore receiving increasing attention. In this

paper, the research progress of classic (thermoplastic, thermosetting)

polyimide adhesive, polyimide adhesive with molecular structure modification (molecular

main chain structure modification, end group structure modification), and blend

modified polyimide adhesive from the perspective of molecular structure was mainly

reviewed, and the future development trend of polyimide adhesive was

prospected.【Keywords】polyimide; adhesive; molecular structure

modification

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Mr. Bruce

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이메일: Bruce@linkworldgroup.com
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